ESD PLA 3DXSTAT filament
3DXSTAT™ ESD-SAFE PLA 3D Filament 3DXSTAT™ ESD PLA is an advanced ESD-Safe compound designed for use in critical applications that require electrostatic discharge (ESD) protection.
Made using cutting-edge multi-wall carbon nanotube technology, state of the art compounding technology, and precision extrusion processes.
Target surface resistance: 10^7 to 10^9 Ohm.
- 1 Item Items
Benefits of 3DXSTAT™ include:
Ideal for printing without a heated bed
- no enclosure required
" Low shrink / warp - very easy to print
" Low odor
- ideal for printing in public spaces / office environments
" Consistent and reliable surface resistance
" Improved retention of impact & elongation vs. similiar ESD-safe materials
" Low particulate contamination
" Minimal contribution to outgassing and ionic contamination
Typical applications include:
" Semi-con: HDD Components, Housings, Wafer Handling, Jigs, Casings, & Connectors
" Industrial: Fixtures, Conveying, Metering, End-of-arm Tooling, and Sensing applications
Target conductivity for 3DXSTAT™ ESD PLA:
" Spec: 10^6 to 10^9 Ohm surface resistivity on 3DP sample using concentric ring method, target 10^7 Ohm
" Note: Internal studies have indicated that increased extruder temperatures can achieve higher levels of conductivity. Likewise, lower extruder temperatures have resulted in lower levels of conductivity. Each printer is set-up differently as well as varied part geometry. Therefore, expect some trial time to understand how this filament works in your specific printer / application.
Recommended Print Conditions:
" Extruder Temp: Typically 210-220°C. 3DXSTAT™ ESD PLA is a filled product and has a higher melt viscosity vs. unfilled PLA. Therefore, it is sometimes necessary to print at higher temperatures than your standard PLA to allow the resin to flow properly.
" Extrusion Multiplier: 1.15 - 1.20
" Extrusion Speed: 60mm/s or higher
" Bed Temp: 23-60°C
" Fan Speed: 50-100% starting on 2nd layer
" Bed Prep: Blue Tape, Hairspray on clean glass
|Melting Point :||170ºC|
|Dscomposition Temperature :||230°C|
|Printed Recommended Temperature :||215±10°C|
|Distorsion Temperature :||55ºC|
|Tolerance :||1,75±0,03 / 3,00±0,05|
|First layer temperature :||215°C|
|Heat bed temperature :||60°C|
|Packing dimensions :||235 x 215 x 80 mm|
|Packing weight :||1.45 kg approx.|