Benefits of 3DXSTAT™ include:

Ideal for printing without a heated bed

- no enclosure required

" Low shrink / warp - very easy to print

" Low odor

- ideal for printing in public spaces / office environments

" Consistent and reliable surface resistance

" Improved retention of impact & elongation vs. similiar ESD-safe materials

" Low particulate contamination

" Minimal contribution to outgassing and ionic contamination

Typical applications include:

" Semi-con: HDD Components, Housings, Wafer Handling, Jigs, Casings, & Connectors

" Industrial: Fixtures, Conveying, Metering, End-of-arm Tooling, and Sensing applications

Target conductivity for 3DXSTAT™ ESD PLA:

" Spec: 10^6 to 10^9 Ohm surface resistivity on 3DP sample using concentric ring method, target 10^7 Ohm

" Note: Internal studies have indicated that increased extruder temperatures can achieve higher levels of conductivity. Likewise, lower extruder temperatures have resulted in lower levels of conductivity. Each printer is set-up differently as well as varied part geometry. Therefore, expect some trial time to understand how this filament works in your specific printer / application.

Recommended Print Conditions:

" Extruder Temp: Typically 210-220°C. 3DXSTAT™ ESD PLA is a filled product and has a higher melt viscosity vs. unfilled PLA. Therefore, it is sometimes necessary to print at higher temperatures than your standard PLA to allow the resin to flow properly.

" Extrusion Multiplier: 1.15 - 1.20

" Extrusion Speed: 60mm/s or higher

" Bed Temp: 23-60°C

" Fan Speed: 50-100% starting on 2nd layer

" Bed Prep: Blue Tape, Hairspray on clean glass